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Atiatec's De-Embedding solution will demo in DesignCon 2018


We would like to invite you for visiting Ataitec in DesignCon 2018. For more informatin, please see the below. 
 
 


You are cordially invited to visit AtaiTec at DesignCon Booth #600 to see how to use In-Situ De-embedding (ISD), Advanced SI Design Kit (ADK) and Material Property Extractor (MPX) to:
  • Perform causal and skewless de-embedding
  • Extract spikes-free PCB trace attenuation
  • Compare ISD and Delta-L results
  • Correlate DUT results between measurement and simulation
  • Process S parameters and run channel simulation
  • Extract PCB material property (DK, DF and roughness)
  • And more
You are most welcome to attend the following free seminar sponsored by Rohde & Schwarz:
  • "In-Situ De-embedding" by C.C. Huang (AtaiTec) and D. Lin (Nvidia), 01/31/2018 (Wed), 9:20am – 10:00am, Great America Meeting Room 2.
Abstract - Traditional de-embedding methods can give non-causal errors in device-under-test (DUT) results if the test fixture and calibration structure have different impedances. This presentation introduces In-Situ De-embedding (ISD) to address such impedance differences using software instead of hardware, thereby improving de-embedding accuracy while reducing hardware costs. Correlation, compliance testing, Delta-L solution, DK/DF extraction and skewless de-embedding will all be discussed.
 
and follow these papers we co-authored:
  • "Hacking skew measurement," 01/31/2018 (Wed), 2:50pm – 3:30pm, Ballroom E.
  • "A NIST traceable PCB kit for evaluating the accuracy of de-embedding algorithms and corresponding metrics," 02/01/2018 (Thu), 11:00 am – 11:45 am, Ballroom G.
Click here to get a complimentary Expo pass.
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